> DDR4 functionality and operations supported as defined in the component data sheet

> 288-pin, command/address/control registered, data buffered, load-reduced dual in-line memory module (LRDIMM)

> Fast data transfer rates: PC4-2933, PC4-2666

> 128GB (16 Gig x 72)

> V DD = 1.20V (NOM)

> V PP = 2.5V (NOM)

> V DDSPD = 2.5V (NOM)

> Supports ECC error detection and correction

> Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals

> Low-power auto self refresh (LPASR)

> On-die internal, adjustable, V REFDQ generation

> 2 package ranks x 4 logic ranks

> On-board I 2 C temperature sensor with integrated serial presence-detect (SPD) EEPROM

> 32Gb, 3DS 4-high die stack x4 package, Master/Slave control logic. Each die with 16 internal banks

> 4 groups of 4 banks each

> Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)

> Selectable BC4 or BL8 on-the-fly (OTF)

> Gold edge contacts

> Halogen-free

> Fly-by topology

> Multiplexed command and address bus

> Terminated control, command and address bus